Event Title

Substrate Integrated E-Plane Waveguide

Location

CSU Ballroom

Start Date

18-4-2016 10:00 AM

End Date

18-4-2016 11:30 AM

Student's Major

Electrical and Computer Engineering and Technology

Student's College

Science, Engineering and Technology

Mentor's Name

Xuanhui Wu

Mentor's Department

Electrical and Computer Engineering and Technology

Mentor's College

Science, Engineering and Technology

Second Mentor's Name

Danyang Huang

Second Mentor's Department

Electrical and Computer Engineering and Technology

Second Mentor's College

Science, Engineering and Technology

Description

With the increase of wireless systems and devices in use today, waveguides have been used in many different communication applications to increase efficiency and power capability. Substrate-integrated waveguide technology provides a solution to problems that arise with previous waveguide technology by constructing the waveguide into a printed circuit board. The compact size and possibility for low cost fabrication processes provide solutions to many of the problems with traditional waveguides, and allow for the integration into many of today’s devices. Previous substrate-integrated waveguides have provided much flexibility in relation to the H-plane requirements and components, however, E-plane designs have largely been constrained by the fid thickness of the printed circuit board. In this project, the orientation of the waveguide provides flexibility in the E-plane to provide for the design of integrated E-plane components into the printed circuit board. The initial design tests the feasibility and performance of an end-launch substrate-integrated E-plane waveguide (SIEW) with a three layer design connected by copper vias. The initial design was created through ANSYS HFSS software by developing the model and optimizing various component specifications throughout the design. The waveguide was optimized to function in the 12-13 GHz range with a return loss.

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Apr 18th, 10:00 AM Apr 18th, 11:30 AM

Substrate Integrated E-Plane Waveguide

CSU Ballroom

With the increase of wireless systems and devices in use today, waveguides have been used in many different communication applications to increase efficiency and power capability. Substrate-integrated waveguide technology provides a solution to problems that arise with previous waveguide technology by constructing the waveguide into a printed circuit board. The compact size and possibility for low cost fabrication processes provide solutions to many of the problems with traditional waveguides, and allow for the integration into many of today’s devices. Previous substrate-integrated waveguides have provided much flexibility in relation to the H-plane requirements and components, however, E-plane designs have largely been constrained by the fid thickness of the printed circuit board. In this project, the orientation of the waveguide provides flexibility in the E-plane to provide for the design of integrated E-plane components into the printed circuit board. The initial design tests the feasibility and performance of an end-launch substrate-integrated E-plane waveguide (SIEW) with a three layer design connected by copper vias. The initial design was created through ANSYS HFSS software by developing the model and optimizing various component specifications throughout the design. The waveguide was optimized to function in the 12-13 GHz range with a return loss.

Recommended Citation

Buchanan, Nicholas. "Substrate Integrated E-Plane Waveguide." Undergraduate Research Symposium, Mankato, MN, April 18, 2016.
http://cornerstone.lib.mnsu.edu/urs/2016/poster-session-A/56