Event Title
A Method and Apparatus for Testing Cohesion Between 40 μm to 50 μm, SAC305 Solder Spheres
Start Date
15-4-2021 4:00 PM
End Date
15-4-2021 4:15 PM
Student's Major
Integrated Engineering
Student's College
Science, Engineering and Technology
Mentor's Name
Jake Swanson
Mentor's Department
Integrated Engineering
Mentor's College
Science, Engineering and Technology
Second Mentor's Name
Ryder Febo
Second Mentor's Department
Integrated Engineering
Second Mentor's College
Science, Engineering and Technology
Description
Team S-cubed was tasked by Aaron Collins, Staff Process Engineer - Advanced Assembly Development Engineering on behalf of Seagate Technology PLC, to design and build a test apparatus to observe and measure the behavior 40 µm to 50 µm, SAC305 solder spheres. During manufacturing the spheres have been observed (intermittently) self-assembling into a bridge structure within a hopper. This prevents movement of the spheres and halts production. Seagate directed the team to identify a method and design an apparatus capable of observing and resolving the sphere to sphere cohesion, or “stickiness,” between different lots, vials, or specimens of 40µm to 50µm, SAC305 solder spheres. The company intends to (later) correlate the results from the test apparatus with observational data from the manufacturing line to form the basis for further investigations of the mechanism causing this behavior. The goal of this project is to devise a test and apparatus able to observe and resolve differences in behavior, but not the precise mechanism at play or a precise value of the force of cohesion between individual spheres.
A Method and Apparatus for Testing Cohesion Between 40 μm to 50 μm, SAC305 Solder Spheres
Team S-cubed was tasked by Aaron Collins, Staff Process Engineer - Advanced Assembly Development Engineering on behalf of Seagate Technology PLC, to design and build a test apparatus to observe and measure the behavior 40 µm to 50 µm, SAC305 solder spheres. During manufacturing the spheres have been observed (intermittently) self-assembling into a bridge structure within a hopper. This prevents movement of the spheres and halts production. Seagate directed the team to identify a method and design an apparatus capable of observing and resolving the sphere to sphere cohesion, or “stickiness,” between different lots, vials, or specimens of 40µm to 50µm, SAC305 solder spheres. The company intends to (later) correlate the results from the test apparatus with observational data from the manufacturing line to form the basis for further investigations of the mechanism causing this behavior. The goal of this project is to devise a test and apparatus able to observe and resolve differences in behavior, but not the precise mechanism at play or a precise value of the force of cohesion between individual spheres.
