A Method and Apparatus for Testing Cohesion Between 40 μm to 50 μm, SAC305 Solder Spheres

Start Date

15-4-2021 4:00 PM

End Date

15-4-2021 4:15 PM

Student's Major

Integrated Engineering

Student's College

Science, Engineering and Technology

Mentor's Name

Jake Swanson

Mentor's Department

Integrated Engineering

Mentor's College

Science, Engineering and Technology

Second Mentor's Name

Ryder Febo

Second Mentor's Department

Integrated Engineering

Second Mentor's College

Science, Engineering and Technology

Description

Team S-cubed was tasked by Aaron Collins, Staff Process Engineer - Advanced Assembly Development Engineering on behalf of Seagate Technology PLC, to design and build a test apparatus to observe and measure the behavior 40 µm to 50 µm, SAC305 solder spheres. During manufacturing the spheres have been observed (intermittently) self-assembling into a bridge structure within a hopper. This prevents movement of the spheres and halts production. Seagate directed the team to identify a method and design an apparatus capable of observing and resolving the sphere to sphere cohesion, or “stickiness,” between different lots, vials, or specimens of 40µm to 50µm, SAC305 solder spheres. The company intends to (later) correlate the results from the test apparatus with observational data from the manufacturing line to form the basis for further investigations of the mechanism causing this behavior. The goal of this project is to devise a test and apparatus able to observe and resolve differences in behavior, but not the precise mechanism at play or a precise value of the force of cohesion between individual spheres.

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Apr 15th, 4:00 PM Apr 15th, 4:15 PM

A Method and Apparatus for Testing Cohesion Between 40 μm to 50 μm, SAC305 Solder Spheres

Team S-cubed was tasked by Aaron Collins, Staff Process Engineer - Advanced Assembly Development Engineering on behalf of Seagate Technology PLC, to design and build a test apparatus to observe and measure the behavior 40 µm to 50 µm, SAC305 solder spheres. During manufacturing the spheres have been observed (intermittently) self-assembling into a bridge structure within a hopper. This prevents movement of the spheres and halts production. Seagate directed the team to identify a method and design an apparatus capable of observing and resolving the sphere to sphere cohesion, or “stickiness,” between different lots, vials, or specimens of 40µm to 50µm, SAC305 solder spheres. The company intends to (later) correlate the results from the test apparatus with observational data from the manufacturing line to form the basis for further investigations of the mechanism causing this behavior. The goal of this project is to devise a test and apparatus able to observe and resolve differences in behavior, but not the precise mechanism at play or a precise value of the force of cohesion between individual spheres.